JPS6045079A - 発光ダイオ−ドを用いたフレキシブルランプ - Google Patents

発光ダイオ−ドを用いたフレキシブルランプ

Info

Publication number
JPS6045079A
JPS6045079A JP58153757A JP15375783A JPS6045079A JP S6045079 A JPS6045079 A JP S6045079A JP 58153757 A JP58153757 A JP 58153757A JP 15375783 A JP15375783 A JP 15375783A JP S6045079 A JPS6045079 A JP S6045079A
Authority
JP
Japan
Prior art keywords
conductive pattern
emitting diode
light emitting
lamp
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58153757A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0452629B2 (en]
Inventor
Masaki Saka
正樹 坂
Takashi Arai
高志 荒井
Takeshi Kawachi
健 河内
Toshihide Kawamura
河村　俊秀
Osamu Waki
脇　脩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Stanley Electric Co Ltd
Original Assignee
Honda Motor Co Ltd
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd, Stanley Electric Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP58153757A priority Critical patent/JPS6045079A/ja
Publication of JPS6045079A publication Critical patent/JPS6045079A/ja
Publication of JPH0452629B2 publication Critical patent/JPH0452629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP58153757A 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ Granted JPS6045079A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58153757A JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58153757A JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Publications (2)

Publication Number Publication Date
JPS6045079A true JPS6045079A (ja) 1985-03-11
JPH0452629B2 JPH0452629B2 (en]) 1992-08-24

Family

ID=15569457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58153757A Granted JPS6045079A (ja) 1983-08-23 1983-08-23 発光ダイオ−ドを用いたフレキシブルランプ

Country Status (1)

Country Link
JP (1) JPS6045079A (en])

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361156U (en]) * 1986-10-08 1988-04-22
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
JPH0192704U (en]) * 1987-12-14 1989-06-19
JPH02189803A (ja) * 1989-01-18 1990-07-25 Koito Mfg Co Ltd 可撓性を有する表示装置
JPH031458U (en]) * 1989-05-19 1991-01-09
JPH0545812U (ja) * 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JPH05185327A (ja) * 1992-01-10 1993-07-27 Think Lab Kk エンボスロールの製作方法
JP2002544673A (ja) * 1999-05-12 2002-12-24 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｌｅｄ−装置
JP2007128821A (ja) * 2005-11-07 2007-05-24 Toshiba Matsushita Display Technology Co Ltd バックライト及びそれを用いた液晶表示装置
JP2009545149A (ja) * 2006-07-21 2009-12-17 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング 複数の発光素子を備えた発光装置および照明装置
WO2014182773A3 (en) * 2013-05-10 2014-12-31 Osram Sylvania Inc. Methods of producing electronic assemblies including a subassembly film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130982U (en]) * 1980-03-04 1981-10-05
JPS5838180U (ja) * 1981-09-08 1983-03-12 株式会社東芝 Ｌｅｄ表示器
JPS58105185U (ja) * 1982-01-08 1983-07-18 クラリオン株式会社 プリント基板等の取付機構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130982U (en]) * 1980-03-04 1981-10-05
JPS5838180U (ja) * 1981-09-08 1983-03-12 株式会社東芝 Ｌｅｄ表示器
JPS58105185U (ja) * 1982-01-08 1983-07-18 クラリオン株式会社 プリント基板等の取付機構

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361156U (en]) * 1986-10-08 1988-04-22
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
JPH0192704U (en]) * 1987-12-14 1989-06-19
JPH02189803A (ja) * 1989-01-18 1990-07-25 Koito Mfg Co Ltd 可撓性を有する表示装置
JPH031458U (en]) * 1989-05-19 1991-01-09
JPH0545812U (ja) * 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JPH05185327A (ja) * 1992-01-10 1993-07-27 Think Lab Kk エンボスロールの製作方法
JP2002544673A (ja) * 1999-05-12 2002-12-24 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｌｅｄ−装置
JP2007128821A (ja) * 2005-11-07 2007-05-24 Toshiba Matsushita Display Technology Co Ltd バックライト及びそれを用いた液晶表示装置
JP2009545149A (ja) * 2006-07-21 2009-12-17 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング 複数の発光素子を備えた発光装置および照明装置
WO2014182773A3 (en) * 2013-05-10 2014-12-31 Osram Sylvania Inc. Methods of producing electronic assemblies including a subassembly film

Also Published As

Publication number Publication date
JPH0452629B2 (en]) 1992-08-24

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